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    Please use this identifier to cite or link to this item: http://nccur.lib.nccu.edu.tw/handle/140.119/85329

    Title: 台灣IC設計業者與Fab廠間技術知識連結關係之研究-以系統單晶片(SoC)為例
    Authors: 蔡博文
    Michael Tsai, Po-Wen
    Contributors: 李仁芳
    Michael Tsai, Po-Wen
    Keywords: 系統單晶片
    System on a Chip (SoC)
    technological linkage knowledge flow
    technological characteristics
    Date: 2001
    Issue Date: 2016-04-18 16:25:24 (UTC+8)
    Abstract: 本研究探討台灣IC設計業者與FAB廠間技術知識連結之影響,主要的研究問題包括:(1)IC設計業者內部技術知識連結與知識流通之影響?(2)技術知識特性與IC設計業者跟FAB廠技術知識連結之影響?(3)IC設計業者跟FAB廠技術知識連結與知識流通之影響?
    第一章 緒論
    第一節 研究背景與動機
    第二節 研究目的與問題
    第二章 文獻回顧
    第一節 知識的分類與說明
    第二節 技術知識特性
    第三節 技術知識連結
    第四節 知識流通
    第五節 IC設計業者與IC製造業者概況
    參、系統單晶片(System On a Chip, SoC)
    第三章 研究方法
    第一節 研究架構與研究流程
    第二節 研究變數說明
    第三節 研究設計
    第四節 研究限制
    第四章 IC設計業者個案
    第一節:A公司 CPU&晶片組開發專案
    第二節:B公司 整合型晶片組開發專案
    第三節:C公司 網路晶片開發專案
    第四節:D公司 DVD-ROM開發專案
    第五節:E公司 無線滑鼠開發專案
    第六節:F公司 NOTEBOOK相關IC&消費性IC開發專案
    第七節 IC設計業者個案整理
    第五章 FAB廠個案
    第三節 FAB廠個案整理
    第六章 研究發現
    第一節 IC設計業者內部技術知識連結與知識流通
    第二節 技術知識特性與IC設計業者跟FAB廠技術知識連結
    第三節 IC設計業者跟FAB廠技術知識連結與知識流通
    第七章 研究結論與建議
    第一節 研究結論
    第二節 研究建議
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    Description: 碩士
    Source URI: http://thesis.lib.nccu.edu.tw/record/#A2002001619
    Data Type: thesis
    Appears in Collections:[科技管理研究所] 學位論文

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